Hi Mike - Kirkendall voiding is a diffusion phenomena which means time and
temperature are key variables in making the situation better or worst. More
dwell and higher temp's would be the wrong way to go! Get a copy of this
reference:

"The Discovery and Acceptance of the Kirkendall Effect: The Result of a
Short Research Career", H. Nakajima, Journal of Metals, June 1997, page
15-19.

It has an excellent reference section that may be helpful too. Good Luck.

Dave Hillman
Rockwell Collins
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[log in to unmask] on 03/16/98 03:08:00 PM

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Subject:  [TN] How to reduce Kirkendall void?




As I know it, Kirkendall voiding is caused by  rapid diffusion of gold
molecules. It was typically related to gold finishes. My question is:
What else can be done to reduce the  formation of such void other than
reduce gold thickness?
How about increase dwell time at reflow soldering?
Regards
MIchael Yuen
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