Greetings,

Please assist in questions with 610 interpretaion:

4.2.2 - Nonconforming Defect - Class 1,2,3 - Evidence of fracture between
lead and solder fillet.

     How does this requirement apply to leads that are NOT trimmed?  The
way I read it, this requirement is under the            "Trimmed Lead"
Section of the Soldering requirements.  We have seen untrimmed leads that
have evididence of a     small seperation between the top of the fillet and
the lead face when slightly bent.  We have attempted to minimize
this bending, but have not successfullly eliminated it.  I would tend to
think that the stresses on the fillet from a slight          bend are far
less than those caused by the shock of a cut.

     Nonconforming Defect: Yes or No?

     If nonconforming, is 4.2.2 the location of the definition by which it
is nonconforming?

     If nonconforming, will rework result in superior solder fillet
reliability (compared to Use As Is)?

     For that matter can a Nonconforming Defect (according to strict
interpretation) be dispositioned UAI based on a         judgement of defect
severity? (i.e. 5.2 Nonconforming Defect - 1,2,3, - Assemblies shall be
free of dirt, lint,dross,etc. -    Does this mean that even a single piece
of particulate matter is rejectable?  Again I am assuming that this takes
the  definition to far, and the intent is simply clean boards. ) The
foreward of 610 only mentions rework, repair, or scrap as    options under
Nonconforming.

     (BTW: since not trimmed, these leads do not get inspected at 10X.
Some inspectors claim the fractures are not        obvious under normal
inspection magnification - 3 Diopter)

This turned out kind of long so I will save other questions for my next
Email.

Thanks in advance and good day!

Sean Hager

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