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March 1998

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Subject:
From:
David Anderson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Mar 1998 18:24:17 -0600
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I have very little experience, but I have only seen Kirkendall voiding
mentioned with regard to the wire bonding process (typically the
gold-aluminum interfaces).  From a wire bonding perspective, wouldn't
increasing the temperature or dwell time increase the possibility of
voiding since diffusion rates usually increase with increasing temperature?


George Harman has a few pages on Kirkendall Voiding in his "Wire Bonding in
Microelectronics..." book, but I don't know if you can apply the
information to soldering.

Hopefully someone else will have a better answer.


Dave Anderson
Medtronic, Inc.

Opinions are my own, and not necessarily those of my employer.

>>> "Yuen, Mike" <[log in to unmask]> 03/16/98 03:08pm >>>
As I know it, Kirkendall voiding is caused by  rapid diffusion of gold
molecules. It was typically related to gold finishes. My question is:

What else can be done to reduce the  formation of such void other than
reduce gold thickness?

How about increase dwell time at reflow soldering?

Regards
MIchael Yuen

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