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March 1998

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Subject:
How to reduce Kirkendall void?
From:
"Yuen, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Mar 1998 15:08:00 CST
Content-Type:
text/plain
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text/plain (23 lines) 
As I know it, Kirkendall voiding is caused by  rapid diffusion of gold
molecules. It was typically related to gold finishes. My question is:

What else can be done to reduce the  formation of such void other than
reduce gold thickness?

How about increase dwell time at reflow soldering?

Regards
MIchael Yuen

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