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March 1998

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Subject:
From:
Achim Neu <[log in to unmask]>
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Date:
Tue, 17 Mar 1998 20:32:35 +0100
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Hello Techneterīs

for the use of FBGA there is a need of solderballs which pass the burn
in process if the test will run with solderballs.
Normal eutectic solderballs will deformed and oxidized through this
burin in with 140°C / 20 h.
Has somebody expirience in this area or know a supplier with solderballs
alloys which pass this test ?

Any comments welcome

Achim
R&D
Siemens

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