hello,

I have a few questions concerning package leadframe materials of integrated
circuit packages. I have subscrided only recently to ChipNet and I will
submit the same questions there. However, some of the subscribers on TechNet
may have valuable info on the subject.

-1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which are Fe-Ni
    alloys) still used alot for leadframe design of surface mount devices?
    What is the percentage of copper leadframes on the market today?
-2- is there a finish used for copper leadframes and, if so, what materials
    are used and what is the covered thickness?
-3- who has information on or can list references or literature on the complex
    permeability of non-copper leadframe materials ( (e.g.Invar, Kovar or
    Alloy-42)

All help, however small is appreciated.


regards,

Jan Vercammen

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################