TECHNET Archives

March 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Soldermask Lamination
From:
Achim Neu <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Tue, 17 Mar 1998 20:37:14 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Hello Technet people,

does somebody know a lamination process possible for soldermask
lamination which does not need
a vacuum tool ?
This process will used to laminate soldermask tapes against a flexible
polyimide foil but target is to prevent the need of vacuum.

Regards
Achim
R&D
Siemens

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2