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Subject:	Re: BGA SIR Patterns
From:	Karen Tellefsen <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 16 Mar 1998 20:08:14 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

SIRGuru wrote:
>
> In a message dated 98-03-16 06:34:35 EST, you write:
>
> >  I would like to know if we are any nearer to having IPC SIR combs designed
> >  to go under BGA devices?
> >  Do the IPC have any recommendations for dealing with the situation in the
> >  absence of these coupons?
>
> I would say no.  Considering that BGAs are an array of balls designed to
> contact the board surface, comb patterns under BGAs is not practical.  Most
> SIR testing that I have done relative to BGAs has involved daisy chaining the
> pads together, such that alternating rows of balls form the cathode and anode
> of the SIR test pattern.  There are various ways to approach designing such an
> SIR test pattern, depending on what you are looking for.  My own preference is
> to take the two center rows of balls, daisy-chain them together, and do SIR on
> the two parallel lines.  It should give worst case.
>
> As far as I know, the IPC does not have any efforts at this time to examine
> SIR under BGAs.  Not to say we couldn't, but right now we are focusing on test
> environment levels (temperature and RH for various tests).
>
> Out of curiosity, is there many others out in TechNetLand that are interested
> in doing SIR under BGAs?

Yes, I am.  Most of the BGA patterns I've seen are similar
to those you described.

>
> Doug Pauls
> Chairman, SIR Task Group
>

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