Sam,  I apologize for having to post this on the open forum but my system cannot seem to  find your address when I use return to sender. Anyway, possible other folks may be interested in this as well. 

I am providing the following information you requested. Just so you have a baseline to work from, there are a few things you should know.

We use anode bars and not baskets. Our anode to cathode ratios based on surface sq. inches is in excess of 2.5 to 1.
We target 1.2 mil of copper in the hole. 
Our platers are instructed to plate down 3 holes sizes in the areas having the highest circuit density. ( included ground planes)
We use a standard of 25 ASF.

Your typical high & low copper plating thickness's ?   .0013 - .0017
Your typical variance?  .0006" between high and low areas. "Some" designs we have as much as .0015                                                        variation.
Where on the panel do you see your lower amounts? Usually in the center of the "board" or in ground areas.
        Where on the panel do you see your higher amounts? Always along the edges and in isolated holes.
        How much of a difference do you see between small & larger holes
        say ........ .030" and .160" holes on the same panel?  I would estimate the .160 holes typically plate about 
        20% more.


I don't know how much this helps but its a pretty good picture of what we see. I worked in a few shops around the country and find this pretty common with the exception of automated lines.

Ed

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