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March 1998

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Subject:
Immersion gold on flexible circuits
From:
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TechNet E-Mail Forum.
Date:
Mon, 16 Mar 1998 17:33:20 -0500
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I am manufacturing flexible circuits using immersion gold over electroless
nickel as the finish. If I use a polyimide covercoat there are no problems -
but if I use a photoimageable coverlay the process appears to be hit and miss.
Are dry film photoimageable coverlays subject to outgassing onto the copper
surface leading to problems in the plating process.

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