Hello Technetters
I need to pattern a non-photoimageable PVC polymer layer which I am
spin-coating onto silicon wafers. I have tried spinning on and
patterning a resist layer on top and then etching away the exposed PVC
underneath and then removing the resist / masking material. THe PVC is
etched / dissolved by either THF or Cyclohexanone and both of these seem
to attack the resists and masking materials so far tried. The masking
material has to be removed as the finsih must be the PVC which is 20
microns thick approximately and the masking resist must not have reacted
with or changed in any way the PVC.

Any ideas??
Thanks in advance
Anthony Morrissey

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