Hi Ron
Before we opted to high speed paste dispensing as generally cleaner and
more versatile process , I did evaluations of SSD ;
partly the decision to stay on NiAu at this point of the time was
dictated by switch lands on board .
It's also know as PPT [Precision Pad Technology] ; a Mask Technology
Inc. joint project with Ciba .
Therefore :
1
Mask Technology Inc. ( MASKTEK ) , and Christopher Group (sister co) on
:
2601 South Oak St. ; Santa Ana, CA 92707 ; (714) 557-3383 or (714)
979-7500 ; fax (714) 557-6904
ask for Joanne DeBlis or Andrew Holzmann
their second address is :
9665 Tradeport Drive , Orlando; FL 32827 ; (407) 857-1876 ; fax (407)
826-4087
They'll send you the info pack .
Papers in SMI; U.K./PCIF; SMTA - New & Critical Technologies , files
2
IBM (PCMCIA) ; Motorola (satellites) ; etc.
3
Pending your application , a good concept ; only the sticky spray flux
process to mount componentry I found bit unadvanced .
Perhaps you could stencil the flux too .
The voids are non existent in joints , peel is up , mainly high stress
applications .
Check above for more
4
Ron I don't have latest figures , check above again , it's not cheap and
limited to few pcb houses having the planarization equipment .
Check above
5
This is the high point , joint quality gains are reported (peel) 20 -
30% + .
You'll get data in the pack .
Ask for "A Step in the Right Direction - Part II ; from Damian Holzmann
and Tim Fitzgibbons .
Also , check Optipad from SMW Electronik and Sipad from Seimens AG ;
German co's in the same subject .
Mind you , unless you have your application exactly sorted out and
logistics laterally organised , the light in tunnel may turn to the
freight train dilemma .
Let me know how you go .
See you Paul Klasek ; ResMed
>----------
>From: Ron Hollandsworth[SMTP:[log in to unmask]]
>Sent: Friday, 13 March 1998 0:11
>To: [log in to unmask]
>Subject: [TN] Subj: Solid Solder Deposit Technology
>
> Hello TechNet.
>
> I am interested in any information on Solid Solder Deposit Technology
> (SSD) anyone might have available. I have attended the surface finish
> summit in Minnesota last fall and received some very good information
> written by Andrew Holzmann. I have searched the Internet and found
> information by Werner Maiwald, "Soldering SMD's Without Solder Paste",
> and information/white paper by William G. Kenyon, "Managing the
> transition on a golobal scale -- changing the cleaning agent means
> changes to equipment, processes, process control specifications and
> standards". Both gentlemen address SSD in their papers and the info
> is very informative. I also have information from Binghamton
> University, Watson School of Engineering. All information so far
> claims defect reduction, reduced cleaning, cycle time improvements,
> etc., can be the results of utilizing this technology. What does the
> TechNet think?
>
> 1. Are there other sources of information available and where?
> 2. What companys are using this technology that I could network with?
> 3. What successes would you share if you are using SSD Technology
> now?
> 4. Cost comparisons (Solder Paste vs SSD Technology)?
> 5. Solder Joint quality/reliability using SSD Technology?
>
>
> With markets seemingly on the move to smaller, lighter, cheaper, and
> faster, the higher density finer pitch world must be addressed and SSD
> technology seems to be a light at the end of the tunnel. I hope it's
> not a freight train.
>
> I can be reached on e:mail at [log in to unmask] or through the TechNet,
> which I check daily.
>
> Thanks
> Ron Hollandsworth
> AME Operations Task Leader
> ITT
>
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