Hello TechNet.

     I am interested in any information on Solid Solder Deposit Technology
     (SSD) anyone might have available.  I have attended the surface finish
     summit in Minnesota last fall and received some very good information
     written by Andrew Holzmann.  I have searched the Internet and found
     information by Werner Maiwald, "Soldering SMD's Without Solder Paste",
     and information/white paper by William G. Kenyon, "Managing the
     transition on a golobal scale -- changing the cleaning agent means
     changes to equipment, processes, process control specifications and
     standards".  Both gentlemen address SSD in their papers and the info
     is very informative.  I also have information from Binghamton
     University, Watson School of Engineering.  All information so far
     claims defect reduction, reduced cleaning, cycle time improvements,
     etc., can be the results of utilizing this technology.  What does the
     TechNet think?

     1.  Are there other sources of information available and where?
     2.  What companys are using this technology that I could network with?
     3.  What successes would you share if you are using SSD Technology
         now?
     4.  Cost comparisons (Solder Paste vs SSD Technology)?
     5.  Solder Joint quality/reliability using SSD Technology?


     With markets seemingly on the move to smaller, lighter, cheaper, and
     faster, the higher density finer pitch world must be addressed and SSD
     technology seems to be a light at the end of the tunnel.  I hope it's
     not a freight train.

     I can be reached on e:mail at [log in to unmask] or through the TechNet,
     which I check daily.

     Thanks
     Ron Hollandsworth
     AME Operations Task Leader
     ITT

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