From: Mike Barmuta <[log in to unmask]>
Date: Wed, 11 Mar 1998 14:28:53 pst
Subject: Re: [TN] Kester OSP
To: [log in to unmask],
Cc: [log in to unmask]


        Matthew: Although it's not quite quantum mechanics it is a litle more
complicated than the data sheets lead you to believe. Without trying to speak
for Kester or Enthone-Omi., both processes run pretty much the same for dip
applications. We have been running the 5631-C2 for over five years as a
fabricator, assembler and end user.
Not getting into a lot of detail about the why's and what for's of each step a
properly set up generic line would consist of the following:

1. Soak Clean
2. Rinse
3. Micro Etch
4. Rinse
5. Acid Dip(optional)
6. Rinse(optional)
7. Rinse
8. Coating
9. Rinse
10.Rinse(optional)
11.Warm Air Dry

At best you can expect four rinse tanks, three chemical tanks and a drying unit.
In addition to that you'll need pumps, filters, agitation, heaters, air,
racking/fixturing, DI water etc. If you start shortening or leaving some of
these things out you can still operate but could be faced with quality problems
in the long term.
Also you'll need to have analytical capabilities for things like normality, pH,
Cu and spectroscopy for checking coating thickness. And don't forget about
hazardous waste handling and disposal. Good Luck!

                                                Regards
                                                        Michael Barmuta
                                                        Staff Engineer
                                                        Fluke Electronics
                                                        Everett Wa.
                                                        425-356-6076


On Wed, 11 Mar 1998 11:12:04 -0800 Matthew Park wrote:

> From: Matthew Park <[log in to unmask]>
> Date: Wed, 11 Mar 1998 11:12:04 -0800
> Subject: [TN] Kester OSP
> To: [log in to unmask]
>
> Ok, How many of you (board fab vendors) are using Kester
> 5631-C2 Protecto as OSP coating for pcb?  I read Kester OSP
> technical spec. 10 times comparing with Entek Plus 106A.  It
> appears that applying Kester OSP as a final board finish is much
> simpler and easier.  That makes me believe that any board
> assembly shop can setup a couple of dip tanks and apply the
> OSP coating with a min cost and training.   Or am I being misled
> by the spec?
>
> Your inputs are very much appreciated.
> Mpark
> NII Norsat International Inc.
>
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