Does someone know if there is a separate standard for a Leadless chip
component, such as a SMD chrystal which has Castellated Terminations, but
unlike a Leadless Chip Carrier there are only 3 leads which traverse from
one side of the component to the other.  Since the soldereable area
includes the lead area under the component (all the way from one side to
the other) is the fillet size not as critical as a LCC where the lead is
only on the side of the component and extending partialy to the underside
of the component?

I am interested to know the fillet requirements for such a component?   My
ANS/J-STD-001 dated April 1992, does not cover such a component, and I have
seen references here to the ANS/J-STD-001B.   What are the differences
between those two standards?

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