Why not eliminate the additional soldering operation after conformal
coating?  This can be accomplished by crimping or soldering terminals on
the discrete wires and stuffing the PCB with the mating receptacle (which
is mass soldered during the wave soldering operation).

If the design cannot be changed, I strongly urge you to contact the
procurring activity to determine a relative course of action.  My
suggestion is to utlize a low residue wire core solder that is halide free
and contains less than 2% solids.  Contact an outside laboratory
(Contamination Studies Laboratories or Trace) and have localized ion
chromotography performed on the remaining residues (again suggest that
samples be provided with no cleaning and with cleaning).

Steve Sauer

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