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March 1998

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Subject:
Re: Causes & Corrective Actions for Solder Balls
From:
Ruben Irizarry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Mar 1998 14:29:53 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (101 lines) 
Here are some causes and CA

|------------------------------------+------------------------------------|
|Equipment Process Related           |                                    |
|------------------------------------+------------------------------------|
|Potential Cause                     |Corrective action                   |
|------------------------------------+------------------------------------|
|Solder splash into pot rebounding   |Adjust anti-splash gates            |
|onto board                          |                                    |
|------------------------------------+------------------------------------|
|Insufficient Activator              |Increase conveyor speed             |
|                                    |Increase flux activator/solids      |
|                                    |content                             |
|                                    |Increase quantity of flux applied   |
|                                    |Reduce air-knife pressure           |
|------------------------------------+------------------------------------|
|Vibratory Device in 2nd wave set too|Reduce energy level to vribator     |
|high                                |                                    |
|------------------------------------+------------------------------------|




|------------------------------------+------------------------------------|
|Material Related                    |                                    |
|------------------------------------+------------------------------------|
|Potential Cause                     |Corrective Action                   |
|------------------------------------+------------------------------------|
|Flux Solids content too low         |Correct specific gravity            |
|                                    |Change flux                         |
|------------------------------------+------------------------------------|
|Solder MAsk not cured correctly     |Check at Incoming and correct       |
|------------------------------------+------------------------------------|
|Flux contaminated                   |Drain fluxer and refill with fresh  |
|                                    |flux                                |
|------------------------------------+------------------------------------|
|Solder mask not compatible with flux|Change solder mask or flux          |
|------------------------------------+------------------------------------|




Saludos,
Ruben





[log in to unmask] on 03/16/98 08:06:30 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Ruben Irizarry)
Subject:  [TN] Causes & Corrective Actions for Solder Balls




Good day all,

I have a question relative to solder balls and hope that someone can
shed some light on this issue.

1.  What causes solder balls?
2.  Could solder balls be the result of incompatiability between flux
and soldermask?
3.  How do you eliminate solder balls?
4.  What is the IPC acceptability standards for solder balls?

Any feedback would be greatly appreciated.  Thanks to all that offer
assistance.

Best Regards

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