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March 1998

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TechNet <[log in to unmask]>
Subject:
eless Pd
From:
Josh Moody <[log in to unmask]>
Date:
Mon, 2 Mar 1998 10:21:07 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, Josh Moody <[log in to unmask]>
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Technetters,

I was wodering if anyone out there is currently using Palladium
as a surface finish. I am primarily interested in eless Ni/Pd/ Imm Au.
I know that Atotech and LeaRonal both offer this chemistry, but who
is using (i.e. end users).  What applications are they using it for
(i.e. wirebond, solder attach, socket attach of ASICs) Have any assembly
problems been identified?

Thanks in advance.



Josh Moody
Materials Quality Engineer
Hewlett-Packard - Richardson (HPSD)
ph# (972) 497-4617
[log in to unmask]

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