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March 1998

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Subject:
FAB:Special Process
From:
Ramadoss Srinivasan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Mar 1998 02:11:25 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines) 
Dear Members,

We have received following requirement from a customer.Need suggestion
on how to build the pcb to that requirement

It is pth board with following specs
1.Thickness of copper on the surface to be 500 to 800 microinches
on each side.
2.Thickness of copper in the holes shall be min 500 microinches.
3.The surface shall be plated 2 to 10 micro inch of gold flash.
4.Prefer foil only on the suface instead of foil plus plated copper
5.The above is required on 0.0315 thick laminate

Regards
Botham



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