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Date: | Sun, 29 Mar 1998 13:57:14 -0800 |
Content-Type: | text/plain |
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Kelly Kovalovsky wrote:
>
> I am looking for some information on gold porosity as it applies to common PCB
> edge tab connector contacts. More to the point, I would like to know:
>
> What is a good working definition of porosity?
> What is the common test(s) for porosity and the theory behind the test?
> What are the common causes for test failure?
>
> Kelly Kovalovsky
>
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Kelly, IBM specs define gold porosity very well and have three test
methods to test for gold porosity, GEL, Electrographic Paper and nitric
acid vapor method.
I have retired from IBM and have no direct access to specifications but
you should be able to serach on the internal search facility.
American Electroplaters' Society has several documents that talks about
nature, cause and effect of the porosity in electrodeposits. Also look
into plating magazine December 1969 article by A.A. khan " Porosity
Testing Techniques in Gold deposits", very informative.
By the way at which IBM site you are working? Let me know if you need
further help.
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################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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