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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 20 Mar 1998 05:14:11 +0000 |
Content-Type: | text/plain |
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Hello TechNet,
I have a few questions about acid copper plating mainly pretaining to
distrubutionon the panel.
1)What is the major differances between slab anodes and nuggets,
pros/cons?
2)Is there an optimum agitation speed or stroke length thatcopper plating
is done at, cathode to anode 8" on center.
3)Does anyone use non-air sparged plating, any pros/cons?
One not related to copper plating:
Does any one have any info. on what the conductivity levels for the
rinse tanks in a electroless copper plating line should be?
Any other info. on plating distrubution welcome.
Thanks in advance!
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