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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 18 Mar 1998 15:40:27 +1100 |
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Arlene , a lot us ; guys from HP likely most ;
but you are a bit laconic to be able to answer .
a) of what ?
b) thermal cycling on accelerated test ?
c) to what standard ?
We do here IPC-SM-785 , on flash gold .
Let us know .
Thanks
Paul Klasek ; ResMed
>----------
>From: Arlene Infante[SMTP:[log in to unmask]]
>Sent: Wednesday, 18 March 1998 9:38
>To: [log in to unmask]
>Subject: [TN] Immersion Gold
>
>Does anyone has an experience/idea on PCB Reliability testing with
>Immersion Gold Surface finished?
>
>a) Temperature?
>b) How long on Thermotron chambers?
>c) What is the result?
>
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