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Tue, 10 Mar 1998 05:52:00 -0600 |
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We are currently have a problem with a customer on the requirement
interpretation of section 4.1 of ANSI/IPC-A-610, revision B(for class 2
and 3). With respect to the vertical fill of solder, is it acceptable
for the solder to not reach the top edge(entire 360 degrees) of the
plated through hole on the primary side of the assembly, as long as the
wetting requirements are met?
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