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March 1998

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Date:
Tue, 31 Mar 1998 10:34:11 +0100
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"TechNet E-Mail Forum." <[log in to unmask]>, Hütter Simon <[log in to unmask]>
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Hütter Simon <[log in to unmask]>
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Anna wrote:
>Hello
>I have a question about the standard. When we measure the copper
>thickness in holes and blind vias we use a lins for 200X magnification.
>What says the standard about this? We have the IPC from 1982 and it says
>that we should measure at 100X. At this magnification is hard to se
>properly. Thank you for your help.
>
>E.mail- [log in to unmask]
>--

Anna

IPC-HF-318A, Rev. A, Dec. 91 says:

"... foil and plating integrity at a magnification of 100X, +-5%. Referee examinations
shall be accomplished at a magnification of 200X, +-5%."

Best regards

Simon

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Simon Huetter           Tel.:   +41 71 878 77 77
Dipl. El. Ing. HTL      Fax.:   +41 71 878 77 66
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