TECHNET Archives

March 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Subject:
From:
Kelly Kovalovsky <[log in to unmask]>
Date:
Mon, 23 Mar 1998 16:21:54 -0500
Content-Type:
text/plain
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Kelly Kovalovsky <[log in to unmask]>
Parts/Attachments:
text/plain (21 lines)
I am looking for some information on gold porosity as it applies to common PCB
edge tab connector contacts. More to the point, I would like to know:

What is a good working definition of porosity?
What is the common test(s) for porosity and the theory behind the test?
What are the common causes for test failure?

Kelly Kovalovsky

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2