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February 1998

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Subject:
From:
Achim Neu <[log in to unmask]>
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Date:
Sun, 1 Feb 1998 12:08:23 +0100
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Hello ALL,

do anyone has experience with FBGA packages. Like reflow profils,
reliability on board,
solderball attachment ...

Any information is welcome.

Achim Neu
Package design



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