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February 1998

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Subject:
From:
Joseph Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Feb 1998 16:25:57 -0800
Content-Type:
text/plain
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text/plain (150 lines)
Contact Ron Iscoff Editor at [log in to unmask]




At 12:01 AM 2/4/98 -0800, you wrote:
>TechNet,
>
>Could anyone please tell me who publishes Chip Scale Review magazine &
>who I can subscribe.
>
>Thank you
>
>
>roberto wrote:
>>
>> John Riley wrote:
>> >
>> > IPC has joined forces with SMTA, IMAPS and the Chip Scale Review
>> Magazine to create a
>> > world-class technical forum on the development and application of
>> chip scale
>> > packaging technologies.
>> >
>> > Papers and half-day workshops are sought on all aspects of CSP and
>> other high density
>> > packaging methodologies. Information on board level and circuit
>> design issues are of
>> > particular interest, since substrates are becoming the most
>> technologically critical
>> > aspect of successful CSP adoption.
>> >
>> > Tuesday, May 5, will be devoted to half-day workshops. Technical
>> sessions will follow
>> > on May 6 and 7. The Chip Scale International 98 Exhibition opens on
>> Wednesday, May 6.
>> >
>> > The technical program will address device level packaging and
>> microelectronics,
>> > circuit design and fabrication, and board/module level assembly
>> processes. Paper
>> > topics covering product applications, materials , processes and
>> equipment, test
>> > methods, reliability and performance data will be considered.
>> >
>> > The deadline for abstract submission is February 27, 1998. The
>> deadline for paper
>> > and/or presentation materials is March 27, 1998. Printed materials
>> are mandantory in
>> > order to present at the conference. Presentations must be
>> non-commercial in nature,
>> > focusing on technology rather than a company's product. All
>> presenters will receive
>> > full conference admission at no charge. There will be an honorarium
>> and travel
>> > expenses covered for workshop presenters.
>> >
>> > To submit an abstract, please provide your name, address (including
>> e-mail), and a
>> > 200-300 word description along with a brief biography. Please send
>> to John Riley, IPC
>> > Director of Education,
>> > by e-mail: [log in to unmask] or fax: 847/509-9798.
>> > Also, please indicate if the submission is for the technical program
>> or for a
>> > workshop. If it is a technical paper, please indicate the desired
>> time (30, 45, or 60
>> > minutes).
>> >
>> > This is a tremendous opportunity to learn and contribute your
>> expertise to one of the
>> > most exciting developments in the electronics industry.
>> >
>> > ################################################################
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>> > To subscribe/unsubscribe, send a message to [log in to unmask] with
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>> > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
>> additional information.
>> > For the technical support contact Dmitriy Sklyar at [log in to unmask]
>> or 847-509-9700 ext.311
>> > ################################################################
>> ok
>>
>> ################################################################
>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
>> 1.8c
>> ################################################################
>> To subscribe/unsubscribe, send a message to [log in to unmask] with
>> following text in the body:
>> To subscribe:   SUBSCRIBE TechNet <your full name>
>> To unsubscribe:   SIGNOFF TechNet
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>> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
>> additional information.
>> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>> 847-509-9700 ext.311
>> ################################################################
>
>--
>
>*********************************************************************
>Michael Parker
>Manufacturing Engineer                    Phone:   44 (0)1793 565260
>Motorola GPD
>16, Euroway                               FAX:     44 (0)1793 511716
>Blagrove
>Swindon                                   Page:    0839 763990
>SN5 8YQ
>*********************************************************************
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
>For the technical support contact Dmitriy Sklyar at [log in to unmask] or
847-509-9700 ext.311
>################################################################
>
>
>
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