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February 1998

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Subject:
From:
Doug Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Feb 1998 08:34:53 EST
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Matthew,
What are your typical pre-heat temperatures and your solder temperatures?
Have you done thermal profiling of the reflow environment?  How close are your
reflow parameters to that recommended by your paste and flux vendor?  Is it
possible that your wave solder operator runs the temperatures a little higher
than the setpoints (to get reflow on problem parts)?

Doug Pauls
CSL

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