I'd like to throw out one more issue:

4- Can reliability of BGA's (or any other plastic parts for that matter)
be compromised by exposure to cleaning solvents or solutions?

> ----------
> From:         Blanchet,Richard[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Blanchet,Richard
> Sent:         Wednesday, February 04, 1998 10:46 AM
> To:   [log in to unmask]
> Subject:      [TN] Assy: PBGAs
>
> Hello,
>
> As we hear more and more about BGAs, my perception is that there's
> some
> issues to be improved. From a military/high-end commercial application
> stand
> point, I have the following questions:
>
> 1- Do people put a lot of vias under BGAs to perform ICT or do they
> just
> perform functional tests ?
>
> 2- How do you guys inspect your BGA solder joints once on the card ?
> Are
> X-ray practical and reliable in a production mode ?  What about
> Scanning
> Acoustic Microscopy (like a system from Sonoscan) ?
>
> 3- And what about repairs ?  Are they easily done with a high success
> rate ?
>
> I'm trying to learn anything I can about BGAs, so any info is welcome,
> even
> the most basic ones.
>
> You can reach me off-line at [log in to unmask]
>
> Thank you.
>
>

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