Hello, everyone!!

I am in trouble with "Nodules".

Please inform me about this.

1. What is the correct definition of the word, 'Nodules' , which is kind of phenomenon that
   a group of small balls-like were protruded convexly on the surface of pad or bond finger
   in BGA ?

2. And what kind of problem does this cause in packaging process ?

3. Also what is the spec for that 'Nodules' in judging the BGA  ?

My E-mail address : [log in to unmask]

My name is Jong-Gon Kim.

Thank you very much.

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