TechNet,
Could anyone please tell me who publishes Chip Scale Review magazine &
who I can subscribe.
Thank you
roberto wrote:
>
> John Riley wrote:
> >
> > IPC has joined forces with SMTA, IMAPS and the Chip Scale Review
> Magazine to create a
> > world-class technical forum on the development and application of
> chip scale
> > packaging technologies.
> >
> > Papers and half-day workshops are sought on all aspects of CSP and
> other high density
> > packaging methodologies. Information on board level and circuit
> design issues are of
> > particular interest, since substrates are becoming the most
> technologically critical
> > aspect of successful CSP adoption.
> >
> > Tuesday, May 5, will be devoted to half-day workshops. Technical
> sessions will follow
> > on May 6 and 7. The Chip Scale International 98 Exhibition opens on
> Wednesday, May 6.
> >
> > The technical program will address device level packaging and
> microelectronics,
> > circuit design and fabrication, and board/module level assembly
> processes. Paper
> > topics covering product applications, materials , processes and
> equipment, test
> > methods, reliability and performance data will be considered.
> >
> > The deadline for abstract submission is February 27, 1998. The
> deadline for paper
> > and/or presentation materials is March 27, 1998. Printed materials
> are mandantory in
> > order to present at the conference. Presentations must be
> non-commercial in nature,
> > focusing on technology rather than a company's product. All
> presenters will receive
> > full conference admission at no charge. There will be an honorarium
> and travel
> > expenses covered for workshop presenters.
> >
> > To submit an abstract, please provide your name, address (including
> e-mail), and a
> > 200-300 word description along with a brief biography. Please send
> to John Riley, IPC
> > Director of Education,
> > by e-mail: [log in to unmask] or fax: 847/509-9798.
> > Also, please indicate if the submission is for the technical program
> or for a
> > workshop. If it is a technical paper, please indicate the desired
> time (30, 45, or 60
> > minutes).
> >
> > This is a tremendous opportunity to learn and contribute your
> expertise to one of the
> > most exciting developments in the electronics industry.
> >
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> > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> > For the technical support contact Dmitriy Sklyar at [log in to unmask]
> or 847-509-9700 ext.311
> > ################################################################
> ok
>
> ################################################################
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> following text in the body:
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> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
> 847-509-9700 ext.311
> ################################################################
--
*********************************************************************
Michael Parker
Manufacturing Engineer Phone: 44 (0)1793 565260
Motorola GPD
16, Euroway FAX: 44 (0)1793 511716
Blagrove
Swindon Page: 0839 763990
SN5 8YQ
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TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
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