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February 1998

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Subject:
Re: Corrosion after electroless tin finish
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 28 Feb 1998 04:03:20 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (58 lines) 
Karl Ring wrote:

> hello all
>
> i have a problem with electroless tin plated boards.The cross sections
> show
> in tented vias under the solder mask strong corrosion of the copper
> barrel
> beneath excessive thin. The corrosion must be done in the tin bath.
>
> Do tented vias and electroless tin give generally problems or is it a
> special process  problem?
>
> have a nice weekend
>
> Karl
>
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   Karl,
I am very interested in the answers you will get, if you will get some
answers
directly to you,please be so kind and forward them to me too.
I suppose that the problem is due to incomplete rinsing in small tented
vias , but my experience is limited .I want to know as much as possible
about
this process.If you use boards with electroless tin finish in your
line,please could
you tell me in what applications and what special parameters have to be
changed? What about shelf life?
Thank you,
Gaby

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