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February 1998

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Subject:
pad lifting / pad rotation
From:
"Erat, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 27 Feb 1998 14:36:12 -0500
Content-Type:
text/plain
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text/plain (19 lines) 
We have a customer which is very sensitive to separation between plated
copper and outerlayer foil copper (doublesided product). This condition
is especially visible at high pad rotation after thermal shock. What can
be  done to minimize / avoid this issue ?

Wolfgang Erat / Viasystems Canada

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