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February 1998

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Subject:
Re: Solder balls spec
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Feb 1998 16:05:13 -0600
Content-Type:
text/plain
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text/plain (62 lines) 
ANSI/J-STD-001B mentions solderballs in two places:
8.3.1 Particulate Matter
Assemblies shall be free of dirt, lint, solder splash, dross, wire clippings, etc.
Solder balls must neither be loose nor violate minimum electrical spacing.
Table 11-1, Item 16
Violation of minimum electrical spacing.  This condition includes potential movement
of conductors (including conductive part bodies, leads, wires, etc.) solder balls,
excessive solder and bridging.
Hope this helps.  Jack

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

>>> <[log in to unmask]> 02/26/98 02:50PM >>>
Dear colleagues:
Sorry, but I have to return to the solder balls spec. issue.
I know, that   IPC-S-815B ( 3.6.6) had the criteria for the solder balls  (
less than 0.005", no more than 5 per one sq. inch).

Now, IPC-S-815 was replaced  by J-STD-001.  But , I can not find any solder
balls spec in J -STD.

We are NoClean chemistry users, and will always have tiny  solder balls,
although we are trying to reduce its number.

I need an official document to accept presence of the solder balls up to
the certain level, of course.
Please, help!!
Stella Neyman
Eaton Co.
248-608-7289
E-mail:  [log in to unmask]

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