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February 1998

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Subject:
From:
"Muller, Mary" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Feb 1998 13:34:52 -0800
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text/plain (81 lines)
Stella,

IPC-A-610B, Paragraph 4.1, defines as a nonconforming defect for all
classes:
Solder balls/splashes violate minimum electrical design clearance, or
are not entrapped in a permanent coating or attached to a metal contact.

Nonconforming process indicators for all classes are:
 - Solder balls/splashes which are within 0.13mm of lands or traces, or
exceed 0.13mm in diameter.
 - More than five (5) solder balls/splashes (0.13mm or less) per 600
mm2.

Note: Entrapped is intended to mean normal service environment of the
product will not cause a solder ball to become dislodged.

Hope this helps.

Mary Muller
Materials and Processes
ELDEC Corp.
Lynnwood, WA

> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Thursday, February 26, 1998 12:50 PM
> To:   [log in to unmask]
> Subject:      [TN] Solder balls spec
>
> Dear colleagues:
> Sorry, but I have to return to the solder balls spec. issue.
> I know, that   IPC-S-815B ( 3.6.6) had the criteria for the solder
> balls  (
> less than 0.005", no more than 5 per one sq. inch).
>
> Now, IPC-S-815 was replaced  by J-STD-001.  But , I can not find any
> solder
> balls spec in J -STD.
>
> We are NoClean chemistry users, and will always have tiny  solder
> balls,
> although we are trying to reduce its number.
>
> I need an official document to accept presence of the solder balls up
> to
> the certain level, of course.
> Please, help!!
> Stella Neyman
> Eaton Co.
> 248-608-7289
> E-mail:  [log in to unmask]
>
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