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February 1998

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Subject:
From:
"D'Angelo, Ken" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Feb 1998 09:58:25 -0500
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As a normal part of building bonded PWB / heatsink assemblies, it's
necessary to abrade the bondside of the PWB in preparation of attaching the
heatsink.  We're presently abrading the PWB surfaces with Scotch-brite pads
using a manual method.  This method works great for the prototypes and
engineering models, but any suggestions for streamlining the process for
hundreds of parts?

Just some added info - PWB surfaces can be multifunctional or polyimide
laminate as well as cured no flow prepreg surfaces.  In some cases,
plated-through holes are present and the need to thoroughly clean the
barrels prior to heatsink bonding is critical.

I've heard about the use of plasma (?) etch or a standard PWB scrubber
equipped with Scotch-brite wheels as method of surface preparation.  Not
sure of the pros and cons of alternative methods.

Any thoughts, please advise and thanks in advance.

Ken D'Angelo
Tyco Printed Circuit Group- VAS
15 Tyco Drive
Stafford Springs, CT 06076

T:  (860) 684-8000, ext. 4332
F:  (860) 684-0714

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