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February 1998

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Subject:
Re: NON-THERMALLY RELIEVED VIAS- ring voids -Reply
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Feb 1998 08:05:24 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines) 
Ray,  please discuss it on the technet forum.  Who knows I might
have the same problem and might require your expertise to
tackle it.

re
Matthew Park
NII Norsat International Inc.

>>> raymond lockshier <[log in to unmask]>
February 24, 1998  3:27 pm >>>
Rick,
I think I can solve your dilemma on the ring voids that occur
sporatically
on layers 5 and 6, but there are several questions that I need
answers to
before I can give you advice on what is probably the root of the
problem.
It might be better to discuss this by E-mail  (off the TechNet), so
that we
don't tie up the net.  Either that, or by fax, or telephone.


Ray Lockshier
Independent Contractor for Solder Training, Problem solving,
Product Flow
ect..
1584 78th. Terr. N.
St Petersburg, FL 33702
Phone (813)576-0488     Fax (813)577-3295

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