TECHNET Archives

February 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: NON-THERMALLY RELIEVED VIAS- ring voids
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Feb 1998 08:46:03 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Voids are not thermally induced, but are a function of
board fabrication.

Do you mean you have folds that open up after thermal
excursions resulting in barrel cracks?  These are
usually referred to as "healed" wedge voids at inner
layer/prepreg interfaces.

Susan Mansilla
Robisan Lab

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2