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February 1998

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Subject:
From:
Dudi Banitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Feb 1998 08:38:38 +0200
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Bare board electrical testing system cause dents and damages to the
tested pads by the pressure they apply by the testing pins.
These dents often called witness marks can cause various difficulties
during the assembly process in devices placement, soldering etc.
I am looking for information regarding this matter:
1. Are these damages causing problems at the assembly process? what
kind?
2. Are the damages affecting the assembly yield?
3. If yes, is there any data about the % of savings at the assembly
stage if these damages are avoided?
4. Have the assebly people learn to live with these defects, overcoming
the problems? what is the cost of such overoming? would elimination of
these damages save money by avoiding to use these measures?
5. Will a contactless bare board electrical test system, causing no
damage at all will be an advantage to assembly people? in what sense?
6. What would assembly people be will to do to push further such
technology of bare board testing?
David Banitt
Exsight Ltd
Israel

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