We are using glue printing on solder side for cases where there are no
tht parts.We have used glue print quite a bit. However, we are still in
search for a good method to print glue on mixed technology assemblies
where clinched leads demands clearance of order of 45-60 thou of inch.
Currently, I am working with one company to work out engg stencil for
one mixed tech  assy. Any technet expert on this can advise me .Of my
own, I might have to do expensive trials before I can reach the
solution-
Please post your advise on technet.
ashok

> ----------
> From:         Peggi J. Blakley[SMTP:[log in to unmask]]
> Sent:         February 24, 1998 7:54 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Glue dispenser machine v/s stencil printing
>
> Are you the Ken Patel that use to work for Honeywell in San Diego many
> moons
> ago?
>
> At 07:03 PM 2/23/98 -0800, you wrote:
> >Can anyone tell me what Motorola is using to dispense the glue
> (epoxy)on
> >solder side, glue dispenser or trough stencil printing? Does anyone
> know any
> >contact house uses glue printing method?
> >
> >Any help will be appreciated.
> >
> >re,
> >ken patel
> >______________________________________________________
> >Ken Patel                       Phone:  (408) 490-6804
> >1708 McCarthy Blvd.             Fax:    (408) 490-6859
> >Milpitas, CA 95035              Beeper: (888) 769-1808
> >
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> Peggi J. Blakley
> NAVSURFWARCENDIV Crane
> Code 7062, Building 3241
> 300 Hwy 361
> Crane, In 47522-5001
> Voice:  812-854-2086
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