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February 1998

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Subject:
Re: SM Lead dimension specification
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Feb 1998 11:30:07 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (71 lines) 
Let me suggest:
IPC-SM-782A "Surface Mount Design and Land Pattern Standard" with amendment 1
Covers land patterns for all types of passives and actives: resistors, capacitors,
MELFs, SOTs, SOPs, SOICs, TSOPs, SOJs, QFPs, SQFPs, LCCs, PLCCs, and DIPS. Also
included: -Land Patterns for EIA/JEDEC Registered components - Land Patterns for Wave
or Reflow soldering - Sophisticated Dimensioning System - Via Location - V-Groove
Scroing; 186 pages IPC Member Hard Copy $45; Electronic format, Single User License
$160; nonmember prices are higher
Related documetns IPC-A-49  "Surface Mount Land Pattern Round Robin Artwork" and
IPC-D-275 Design Stgandard for rigid Printed Boards and Rigid Printed Board
Assemblies"

Order with PO or credit card 847.509.9700 or from our web site http://www.ipc.org


Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

>>> Kicha / Krishna <[log in to unmask]> 02/24/98 08:44AM >>>
TechNetters:
   Hi everyone. I appreciate any help with these following questions.

1. Where can I find specifications for standard surface mount gull wing
lead dimensions, such as lead width, the length of the flat portion of
the lead that rests on wet paste for say, 50 mil pitch components ?

2. Are there specifications for board pad dimensions to match the
component lead dimensions ? If yes, where can I find them ?

3. Are the specifications dependent on which side the components are
mounted (top side / bottom side) to account for the extra care needed
with regard to surface tension to hold the components on the bottom side
during second reflow.

Thanks for your time

Regards
Krishna Kalyan

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