Now we used tenting plating process for made circuit board.
 In this process used for univesal MS ADDITIVE  at atotech com.
 Now current density 2.7A/dm2, Total ampere 1200AMP.
 But when now  plating, happend roughness plating, as liek residual Cu at
 surface ,
 It' looks like particle of Copper by burning at plating bath.
 It makes a open at imaging process,
 I guess it relations with air agitation, leveller, carrier concentration
 of copper plating bath.
 But analasys datum have no N.G .
 what can I do efficience easily removes that.

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