Bill, there is additional pictorial support in IPC-A-610, figure 4-2, but it isn't
quite as good even as the figure 9-3 in the J-STD.  This area is acknowledged to be
difficult to understand, and the C revision to IPC-A-610 is improving the existing
graphic and adding nine additional graphics and pictures.  The project has a high
priority level, with graphic enhancement and development all that is remaining to
take the document to the "Proposal" level at the next meeting during IPC Printed
Circuit Board EXPO in April. (http://www.ipc.org/html/framesetexpocov.html)

You are correct that a magnified top-down look in a hole doesn't provide much
opportunity to get what you need to compare to a cross-sectional view represented by
a diagram.  I suspect that your problem is less of knowing what the solder connection
should look like, and more of wanting some comparison picture examples.  If anyone
has any pictures of this nature I would be pleased to discuss using them in our
documents.

Thanks to all for their TechNet support.  We are always open to suggestions for
improvements.  Please send comments back to me directly ([log in to unmask]) rather than
to the whole forum.  Jack

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

>>> "Kasprzak, Bill (esd) US" <[log in to unmask]> 02/23/98 10:04AM >>>
I have a question concerning minimum solder criteria as per the J-Std-001 (A
or B), Table 9-1 and Figure 9-3, Class 3.

I have a situation where the solder joint on the solder source side has 100%
Circumferential wetting, the fillet is concave and well wetted to the lead.
On the solder destination side, the vertical fill is 75% to 100%, but  it is
hard to discern whether we have the 270 degree circumferential wetting
between the lead and the barrel. My question (request ?) is, in viewing
Figure 9-3, the sketches show minimal destination side solder joints. Are
there any pictures available that adequately show the wetting between the
solder and the lead when given the minimum fill of the PTH? It is difficult
to determine the wetting of the solder on the lead at 10 power when the
solder is at this minimal level.

You may respond either to the Tech Net or directly to me at
[log in to unmask]

I have been able to make the necessary process adjustments in order to avoid
this minimal condition. I am just trying to get a better determination of
wetting on the solder destination side when given a perfect looking solder
joint on the solder source side.

Bill Kasprzak
Moog Inc.
716-652-2000 ext 2507
716-687-4378 (fax)

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