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February 1998

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Subject:
From:
"Richard W. Boerdner" <"[log in to unmask]"@BUFFNET.NET>
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Date:
Mon, 23 Feb 1998 09:49:51 -0500
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We are having problems with via holes that are located directly on smt
pads.  During reflow the paste will flow away from the leads and collect
insde of the via hole.  We use water soluable paste, and a 6mil screen
with the apertures reduced 10%.  If anyone has any input on how to
resolve this problem please reply.

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