I have a question concerning minimum solder criteria as per the J-Std-001 (A
or B), Table 9-1 and Figure 9-3, Class 3.

I have a situation where the solder joint on the solder source side has 100%
Circumferential wetting, the fillet is concave and well wetted to the lead.
On the solder destination side, the vertical fill is 75% to 100%, but  it is
hard to discern whether we have the 270 degree circumferential wetting
between the lead and the barrel. My question (request ?) is, in viewing
Figure 9-3, the sketches show minimal destination side solder joints. Are
there any pictures available that adequately show the wetting between the
solder and the lead when given the minimum fill of the PTH? It is difficult
to determine the wetting of the solder on the lead at 10 power when the
solder is at this minimal level.

You may respond either to the Tech Net or directly to me at
[log in to unmask]

I have been able to make the necessary process adjustments in order to avoid
this minimal condition. I am just trying to get a better determination of
wetting on the solder destination side when given a perfect looking solder
joint on the solder source side.

Bill Kasprzak
Moog Inc.
716-652-2000 ext 2507
716-687-4378 (fax)

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