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February 1998

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Subject:
From:
fulabhai <[log in to unmask]>
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Date:
Sat, 21 Feb 1998 21:41:00 -0800
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FANG J L wrote:
>
> My company is a manufacturing company of PCB,specially for COB and BGA
> board.
> I have tested many brighteners of bright acid copper,but the copper
> deposits are
> all have meny small (1-5 um) nodules.After nickel and gold plating,these
> nodules
> will influnence the gold wire bonding.Is there any way to prevent or remove
> the
> nodules? Any new brightener of bright acid copper plating and methods of
> preveting
> and removing would be welcomed.
>
> Jing Li Fang
> Pricipal engineer
> Gul Technologies Singapore Ltd
> Tel:(65)8624095(DID)
> Fax;(65)8615519
> E-mail:[log in to unmask]
>
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Jing Li Fang,
  Plating is scentific as well as vary practical thing.  To control
pitting/ nodules , do some basic steps as follows.
1. Minimise air . Airless plating is the best. Increase soluton movement
   and cathode bar movement .
2. Double check optical density of working film and developing
parameters.
3. Keep micro-etch less aggresssive.
4. Check ripples in D. C. current.
5. Run series of HULL CELL tests to determine ideal parameter.
6. Work with plater and supervise process personnaly.
7. Are components of brighter out of balance ? What kind of brightner
   you are using ?
8. Double check the fomation  and nature of anode film.

  And there are other lot of reasons..known as well as unknown..as per
  shop enviroment..
   Wish you will get control soon.
    Fulabhai Patel                  [log in to unmask]

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