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February 1998

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Subject:
From:
FANG J L <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 22 Feb 1998 11:51:07 +0800
Content-Type:
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My company is a manufacturing company of PCB,specially for COB and BGA
board.
I have tested many brighteners of bright acid copper,but the copper
deposits are
all have meny small (1-5 um) nodules.After nickel and gold plating,these
nodules
will influnence the gold wire bonding.Is there any way to prevent or remove
the
nodules? Any new brightener of bright acid copper plating and methods of
preveting
and removing would be welcomed.

Jing Li Fang
Pricipal engineer
Gul Technologies Singapore Ltd
Tel:(65)8624095(DID)
Fax;(65)8615519
E-mail:[log in to unmask]

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