TECHNET Archives

February 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Solder paste relaxation/characteristic time
From:
tana <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Feb 1998 15:36:37 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Hi Technetters!

I am interested in the measurement of solder paste relaxtion and
characteristic time. In articles I've seen so far (especially Jennie
Hwang's books), there is no mention of the actual experiment. Are
these parameters the same things?

Thanks

Tennyson Nguty, AeroMech Department, Newton Building, Salford University
Manchester M5 4WT, UK. Tel: 0161-295 5951/4696, Fax: 0161-295 5575/5108

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2