TECHNET Archives

February 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Feb 1998 11:07:35 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
Joseph,

     Naw...it shouldn't hurt a thing. That's standard practice for double-
sided reflow in a cleaning environment.
Print/place/reflow/clean/print/place/reflow/clean. Moisture absorbtion takes
place over time. I would worry more about the time period between topside and
bottomside assembly than I would about the D.I. rinse.


-Steve Gregory-

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2