Dear TechNetters !
Assuming that the boards are ordered and manufactured according to
IPC-J-STD-003,but stored in a noncontrolled environment for more
than 1 year, I would like help on the  following-(for eutectic
tin/lead):
1.What is the known growth rate of the intermetallic,and what is the
minimum tin/lead thickness left?
2.If there is moisture absorbed,but the plating in holes is without
defects
concerning thickness,voids,drilling,a.s.o.,should I expect blowholes?
3.What is the maximum intermetallic growth after drying for 3 hrs at
120C?
4.Are delamination problems encountered in almost all or few boards
which absorbed moisture ,and is this related more to the manufacturer's
workmanship?
5.Finally would drying decrease solderability so much as to render
boards
unsolderable with no-clean fluxes?
Could somebody give me some information very QUICKLY?
Thank you all,
GABY

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